Φ = inner, outer diameter, custom-made Features Paper base and Cloth base. Pipe Φ innner diameter, outer diameter, both custom-made L = 500mm, 1000mm
Topics
Shinmeilite Bakelite
- Paper base and Cloth base.
- Pipe
- Φ innner diameter, outer diameter, both custom-made
- L = 500mm, 1000mm
Nikkokasei Heat Resistant Material
BESTHERMO Bending and compressive strength Chemicak resistance Thermal insulating Minimum permanent strain Reduce lead time and energy Mold homogenization temperature LOSSNA-BOARD Thermal insulating Dimensional stability Compression resistance Compression creap properties…
BESTHERMO
- Bending and compressive strength
- Chemicak resistance
- Thermal insulating
- Minimum permanent strain
- Reduce lead time and energy
- Mold homogenization temperature
LOSSNA-BOARD
- Thermal insulating
- Dimensional stability
- Compression resistance
- Compression creap properties
- Arc resistance
- Reduce lead time and energy
- Mold homogenization temperature
(BESTHERNO, LOSSNA-BOARD are trademarks of Nikko Kasei Co., Ltd.)
Shinmeilite Glass Epoxy
Custom-made inner/outer diameteres, L = 500mm, 1000mm
- G10 regulation.
- Diameter Φ≤100mm, custom-made.
- Φ≤100mm, L=1000mm
DIC Tape
DAITAC#8800CH(W) Excellent adhesive strength and removability from various plastics and metals. Dimensional stable backing provides excellent stability and tape application。 Excellent repulsion resistance on curved surface and good heat resistance. Sizes: max. width 1000mm
DAITAC#8800CH(W)
- Excellent adhesive strength and removability from various plastics and metals.
- Dimensional stable backing provides excellent stability and tape application。
- Excellent repulsion resistance on curved surface and good heat resistance.
- Sizes: max. width 1000mm, length 50mm/roll, thickness 0.145mm
Nikkokasei NIKKO PALLET
t = 3mm, 4mm, 5mm, 6mm, 8mm, 10mm in stocks, deliverable. Features Thermosetting resin insulates from surrounding heat. No masking tape reduces process flows. Light weight improves workability. Min. 0.5mm thickness for FPC reflow…
- Thermosetting resin insulates from surrounding heat.
- No masking tape reduces process flows.
- Light weight improves workability.
- Min. 0.5mm thickness for FPC reflow pallet.
- ESD
- Higher heat resistance than FR-4 for lead-free soldering.
Thickness | 0.5~30mm |
Max.Use Temp | 350℃ |
Flexural Strength | 480MPa(常態) 280MPa(200℃) |
Surface Resistivity | 105~8Ω |
Thermal Conductivity | 0.55w/mk |
Linear Thermal Ex. Coef. | 1.0×10-5 |
Acrylic Rod, Pipe
Features Rod Extrud Φ≧150mm Rod Cast Φ≧90mm Pipe Extrud Φ≧100mm / 20mm Pipe Cast Φ≧200mm / 3mm
- Rod Extrud Φ≧150mm
- Rod Cast Φ≧90mm
- Pipe Extrud Φ≧100mm / 20mm
- Pipe Cast Φ≧200mm / 3mm